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Lectures Scheduled date

Number                                              Review Topics             ReferencesActual Date
Lecture 1Review on Semiconductor Physics & IC Technology and AdvancementPPTJan-2016

Number                                              UNIT I             ReferencesActual Date
Lecture 2-15
  • Introduction To IC Technology: SSI, MSI, LSI, VLSI Integrated Circuits
  • Crystal Growth and Wafer Preparation: Electronic Grade Silicon,Czochralski Crystal Growth, Silicon Shaping,Processing Considerations.
  • Epitaxy: Vapor Phase Epitaxy, Molecular Beam Epitaxy, Silicon on Insulators, Epitaxial Evaluation.
  • (1) S. M. Sze, "VLSI Technology", 2nd Edition, TMH. (2) S.K. Ghandhi, "VLSI Fabrication Principles", 2nd Edition, Willy-India Pvt.LtdFeb-2016

    Number                                              UNIT II Topics covered             ReferencesActual Date
    Lecture 16-26
  • Oxidation: Growth Kinetics, Thin Oxides, Oxidation Techniques andSystems,Oxides Properties.
  • Lithography: Optical Lithography. Photo masks, Wet Chemical Etching.
  • Dielectric and Polysilicon Film Deposition: Deposition Processes, Polysilicon, Silicon Dioxide, Silicon Nitride.
  • (1) S. M. Sze, "VLSI Technology", 2nd Edition, TMH. (2) S.K. Ghandhi, "VLSI Fabrication Principles", 2nd Edition, Willy-India Pvt.LtdFeb-2016

    Number                                              UNIT III Topics covered             ReferencesActual Date
    Lecture 27-40
  • Diffusion: Diffusion of Impurities in Silicon and Silicon Dioxide,
  • Diffusion Equations, Diffusion Profiles, Diffusion Furnace,
  • Solid, Liquid and Gaseous Sources, Sheet Resistance and its Measurement.
  • Ion-Implantation: Ion-Implantation Technique, Range Theory, ImplantationEquipment
  • (1) S. M. Sze, "VLSI Technology", 2nd Edition, TMH. (2) S.K. Ghandhi, "VLSI Fabrication Principles", 2nd Edition, Willy-India Pvt.LtdMar-2016

    Number                                              UNIT IV Topics covered             ReferencesActual Date
    Lecture 41-47
  • Metallization: Metallization Application, Metallization Choices, PhysicalVapor Deposition, Vacuum Deposition, Sputtering Apparatus
  • Packaging of VLSI devices: Package Types, Packaging Design Consideration
  • VLSI Assembly Technologies, Package FabricationTechnologies.
  • (1) S. M. Sze, "VLSI Technology", 2nd Edition, TMH. (2) S.K. Ghandhi, "VLSI Fabrication Principles", 2nd Edition, Willy-India Pvt.LtdMar-2016

    Number                                              UNIT V Topics covered             ReferencesActual Date
    Lecture 48-55
  • VLSI Process Integration: Fundamental Considerations For IC Processing
  • NMOS IC Technology
  • CMOS IC Technology & Bipolar IC Technology,
  • Monolithic and Hybrid Integrated Circuits, IC Fabrication
  • (1) S. M. Sze, "VLSI Technology", 2nd Edition, TMH. (2) S.K. Ghandhi, "VLSI Fabrication Principles", 2nd Edition, Willy-India Pvt.LtdApril-2016

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    Last updated on January 2016 at 15:16 IST